Pressurization/decompression tabletop clean oven with pressure control mechanism

Basic evaluation of various materials can be performed under a wide range of pressure and heating temperature conditions.

PCO-083TA product image

The PCO-083TA tabletop clean oven for pressurization/decompression automatically adjusts the pressure during processing in response to requests from customers who want to process under a constant pressure from the start of room temperature and want to easily set the pressure. We have added a function that can be

Please use the pressurization/decompression tabletop clean oven with pressure control mechanism for the development of chips and materials by heat treatment under pressure or decompression, and for small-scale production.

Pressurization/decompression compatible desktop clean oven PCO-083TA

feature

• Effective in the mounting (sealing) process of semiconductors and LEDs.
• It has both vacuum oven and pressure oven functions.
• This oven is suitable for heat treatment of thick resin films such as polyimide and resins that easily foam.
• Various heat treatments such as reduced pressure heat treatment for solvent removal and pressurized heat treatment for bubble removal are available.
• Programmable heating control allows easy operation by simply selecting a basic heating program.
• Heat treatment is always possible under a constant pressure without worrying about the treatment temperature.
• Pressure setting (pressurization area) can be easily done on the pressure indicator.
• It is a clean specification that can handle up to 8-inch wafers.
• Not subject to high pressure regulations.

External dimensions

Device specifications (PCO-083TA)

*Model PCO-083TAH that can be heat treated at 400°C is also available.
*Varies depending on the displacement of the vacuum pump.
*Specifications are subject to change without notice.

pressure heating effect

Observation of bubbles from the PI (polyimide) substrate surface
 

Air bubbles that existed before treatment are not observed after pressure and heat treatment.

*The effect may vary depending on the resin used, device structure, etc.

Closed structure effect

Best suited for polyimide cure

1. The replacement mode allows replacement of oxygen (air) and nitrogen inside the container.
2. 密閉構造なので、外部からの酸素が入り込む心配がありません。→10ppm以下の酸素濃度管理が容易です。
3. There is no need for nitrogen flow during heating after oxygen concentration reduction. →The amount of nitrogen can be reduced and temperature uniformity can be improved. (There is no temperature variation due to nitrogen flow)

Figure 1. Oxygen concentration measurement during nitrogen replacement mode operation

Suitable for various cures

1. Since it uses an external heating system, it can be used with gases other than nitrogen and air (excluding combustible and explosive gases). (Sintering of sol-gel film in pressurized oxygen atmosphere, etc.)

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