Basic evaluation of various materials can be performed under a wide range of pressure and heating temperature conditions.
![Product image](https://keytech.ntt-at.co.jp/equipment/images/p0019_1_1.jpg)
The PCO-083TA tabletop clean oven for pressurization/decompression automatically adjusts the pressure during processing in response to requests from customers who want to process under a constant pressure from the start of room temperature and want to easily set the pressure. We have added a function that can be
Please use the pressurization/decompression tabletop clean oven with pressure control mechanism for the development of chips and materials by heat treatment under pressure or decompression, and for small-scale production.
Pressurization/decompression compatible desktop clean oven PCO-083TA
feature
- Effective in the mounting (sealing) process of semiconductors and LEDs.
- It has both vacuum oven and pressure oven functions.
- This oven is suitable for heat treatment of thick resin films such as polyimide and resins that easily foam.
- Various heat treatments such as reduced pressure heat treatment for solvent removal and pressurized heat treatment for bubble removal are available.
- Programmable heating control allows easy operation by simply selecting a basic heating program.
- Heat treatment is always possible under a constant pressure without worrying about the treatment temperature.
- Pressure setting (pressurization area) can be easily done on the pressure indicator.
- It is a clean specification that can handle up to 8-inch wafers.
- Not subject to high pressure regulations.
External dimensions
![Dimensions](https://keytech.ntt-at.co.jp/equipment/images/p0019_2_1.jpg)
Device specifications (PCO-083TA)
Maximum processing temperature | 350℃ ※ |
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pressure range | 0.5M to 10Pa* |
sample size | Maximum 8 inch Φ |
Inner dimensions of container | Φ240×H160mm |
N2 source used | 0.5 MPa (for pressurization or replacement) |
power supply | 200V, 50/60Hz, 2.5kVA |
External dimensions | 710 × 620 × 653 (mm) |
weight | about 90 kg |
accessories | Vacuum pump |
*Model PCO-083TAH that can be heat treated at 400°C is also available.
*Varies depending on the displacement of the vacuum pump.
*Specifications are subject to change without notice.
pressure heating effect
Observation of bubbles from the PI (polyimide) substrate surface
![pressure heating effect](https://keytech.ntt-at.co.jp/equipment/images/p0016_3.jpg)
Air bubbles that existed before treatment are not observed after pressure and heat treatment.
*The effect may vary depending on the resin used, device structure, etc.
Closed structure effect
Best suited for polyimide cure
- The replacement mode allows replacement of oxygen (air) and nitrogen inside the container.
- 密閉構造なので、外部からの酸素が入り込む心配がありません。→10ppm以下の酸素濃度管理が容易です。
- There is no need for nitrogen flow during heating after oxygen concentration reduction. →The amount of nitrogen can be reduced and temperature uniformity can be improved. (There is no temperature variation due to nitrogen flow)
![Oxygen concentration measurement during nitrogen replacement mode operation](https://keytech.ntt-at.co.jp/equipment/images/p0016_4.jpg)
Suitable for various cures
- Since it uses an external heating system, it can be used with gases other than nitrogen and air (excluding combustible and explosive gases). (Sintering of sol-gel film in pressurized oxygen atmosphere, etc.)
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加圧/減圧対応卓上型クリーンオーブン パンフレット | 737KB | download |
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