This is a SiC or SiN thin film membrane used as a standard sample holder for X-ray analysis and electron beam analysis (SEM, TEM).
It can be customized to suit your needs as shown below.
dicing mold
It can be customized to suit your needs as shown below.
- Metal thin film formation for use as a thin film target or beam splitter.
- Slit/pinhole formation for use as a beam shaping element.
- Sub-50 nm thick membrane (SiN) for use as soft X-ray or electron beam transmission element
Standard product specifications
SiC | SiN (Insulating) | |
---|---|---|
Material | Amorphous or polycrystalline | Amorphous SiN |
thickness | 100 nm - 2 μm | 50 nm - 2 μm |
window size | 0.1 mm to 10 mm square (depending on film thickness) | |
Cutting chip size | 2.1 mm - 20 mm Square | |
Frame Thickness | 0.2 mm - 0.625mm | |
substrate | Diameter 4 inches Si substrate | |
option | Metal coating, slit/pinhole formation |
Usage
- Sample holder for X-ray, electron beam, and EUV analysis
- Liquid cell window material for chemical and biological analysis
- vacuum window
- Support material for transmission type X-ray optical element
Production example
dicing mold
wafer type