Automatic heating and pressure processing device

"Resin encapsulation" is an indispensable process for semiconductor assembly. The problem with this process is the bubbles that are generated. The automatic heating and pressurizing device realizes reliable processing with stable temperature distribution in the tank. We have a lineup of functions and sizes that match the sample to be processed.
 

Air bubbles are removed using automatic heating and pressure processing

This is how air bubbles are removed from OCA film by applying pressure.

 

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Automatic heating and pressurizing equipment ACS series

Feature

• Stable temperature distribution with a stirring mechanism using a magnetic coupling system
• Lineup of various sizes according to the sample to be processed
• Compatible with N2 gas
• Maximum pressure 0.8 MPaG (1.0 MPaG for option)

Specification

item	ACS-230	ACS-450	ACS-650
Apparatus outline (mm)	W700 × H1,270 × D785	W995 × H1,520 × D1,200	W1,225 × H1,570 × D1,450
Effective inner dimension (mm)	Φ200×D280	Φ395×D460	Φ570 × D565
Weight (kg)	190	500	700
power supply	AC100V single phase 15A (100V AC 1Φ15A)	AC200V single phase 30A (200V AC 1Φ30A)	AC200V 3-phase 40A (200V AC 3Φ40A)
Normal pressure range (gauge pressure)	Standard: 0.1 to 0.8MPaG Option: 0.1 to 1.0MPaG
Normal temperature range	Standard: RT+10 to 160°C Option: 180°C or 200°C
Compressed air supply	0.9 MPaG (for standard 0.8 MPaG specification)

 

Vacuum to Pressurization Temperature/Environment Evaluation System BCS-650/G

Feature

• This is an environmental tester that performs various tests on materials, parts, etc. in a vacuum to pressurized environment.
  Programmable pressure, temperature and time during testing (16 steps x 64 patterns)
• Equipped with a voltage application terminal.
  It is possible to connect the power supply and electrical signals of test parts in the pressure vessel to external measuring instruments.
• Equipped with two observation windows for camera photography (for lighting + for observation)
  It can also be used for deterioration testing by installing a UV lamp. * Compatible models: BCS-650G

Specification

item	BCS-650G	BCS-650
External dimensions (mm)	W1225 × H1570 × D1450
Effective dimension (mm)	φ568×D647
Volume (L)	163
Normal pressure range (gauge pressure)	-90KPaG to 1.0MPaG	-90KPaG to 0.8MPaG
Normal temperature range	RT+20～200℃	RT+20～160℃
power supply	AC200V 3 phase 40A (200V AC 3Φ40A)
Gas used	Clean compressed air/N2
Pressure vessel standard	Class 2 pressure vessel
Observation window for camera shooting *	For lighting + for observation (2 pieces)	－
Voltage application terminal	For power: 2pin For signal: 12pin

* Direct visual observation is not possible for safety reasons. For camera shooting (with mount for camera installation)

 

Pressure defoamer TBR series

Feature

• Stable temperature distribution in the tank with a stirring mechanism using a magnetic coupling system
• Lineup from small laboratory type to large size

*The TBR series does not support N2.

Specification

item	TBR-400	TBR-600	TBR-901
Apparatus outline (mm)	W610 × H1,490 × D840	W800 × H1,535 × D1,200	W1,400 × H1,830 × D1,710
Effective dimension (mm)	Φ395 × D450	Φ550×D565	Φ840×D1,040
Weight (kg)	200	300	1,000
power supply	AC200V single phase 10A (200V AC 1Φ10A)	AC200V single phase 15A (200V AC 1Φ15A)	AC200V single phase 22A (200V AC 1Φ22A)
Normal pressure range (gauge pressure)	0.1 to 0.5MPaG	0.1 to 0.5MPaG	0.1 to 0.6MPaG
Normal temperature range	RT+10～80℃	RT+10～70℃	RT+10～70℃
Compressed air supply	0.7 to 1.0 MPaG (clean compressed air)

 

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