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  • Adhesive fixation on the order of submicrons is possible because there is very little change in fixing position due to curing or temperature changes.
*Low cure shrinkage (less than 2%)
*Low coefficient of thermal expansion (40 ppm/°C or less)
  • AT9290F becomes transparent after curing
  • High reliability that withstands heat cycle tests (-40 to 85°C)
  • High heat resistance (260°C) that withstands solder reflow processing

Coefficient of thermal expansion and cure shrinkage

[Usage example] Fixing micro ball lenses

Image diagram
Image diagram
Temperature characteristics of LD module
Temperature characteristics of LD module

Characteristic value

model number
[main component]
Curing conditions
[Irradiation intensity, time]
cure shrinkage
Glass-transition temperature
Tg (°C)
coefficient of thermal expansion
Adhesion strength
[Epoxy] (*1)
25,000 100mW/ cm2
10 minutes
2 206 23 >116 low viscosity
[Epoxy] (*1)
45,000 100mW/ cm2
10 minutes
1 140 31 >200 Transparent after curing (Large curing depth)
[Epoxy] (*1)
180,000 100mW/ cm2
10 minutes
0.5 195 20 >210 Small cure shrinkage
high viscosity
[Epoxy] (*1)
36,000 100mW/ cm2
10 minutes
0.9 233 18 >220 low viscosity
*1...This is a product containing "Non-medicinal deleterious substances" (Please refer to SDS (MSDS) for handling)

The characteristic values in the table are sample measurement values, not guaranteed values.

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